JPH0221156B2 - - Google Patents
Info
- Publication number
- JPH0221156B2 JPH0221156B2 JP17178381A JP17178381A JPH0221156B2 JP H0221156 B2 JPH0221156 B2 JP H0221156B2 JP 17178381 A JP17178381 A JP 17178381A JP 17178381 A JP17178381 A JP 17178381A JP H0221156 B2 JPH0221156 B2 JP H0221156B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- multilayer wiring
- type
- layer
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 55
- 239000012212 insulator Substances 0.000 claims description 15
- 239000010410 layer Substances 0.000 description 45
- 238000007639 printing Methods 0.000 description 12
- 239000011229 interlayer Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17178381A JPS5873196A (ja) | 1981-10-27 | 1981-10-27 | 多層配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17178381A JPS5873196A (ja) | 1981-10-27 | 1981-10-27 | 多層配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5873196A JPS5873196A (ja) | 1983-05-02 |
| JPH0221156B2 true JPH0221156B2 (en]) | 1990-05-11 |
Family
ID=15929596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17178381A Granted JPS5873196A (ja) | 1981-10-27 | 1981-10-27 | 多層配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5873196A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59215796A (ja) * | 1983-05-24 | 1984-12-05 | 日本電気株式会社 | 厚膜多層配線基板 |
| JP3087899B2 (ja) * | 1989-06-16 | 2000-09-11 | 株式会社日立製作所 | 厚膜薄膜混成多層配線基板の製造方法 |
-
1981
- 1981-10-27 JP JP17178381A patent/JPS5873196A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5873196A (ja) | 1983-05-02 |
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